SK hynix held a groundbreaking on August 27, 2026, for its advanced packaging fab in West Lafayette, Ind., which will produce high-bandwidth memory (HBM) in the USA starting in the second half of 2029, the Seoul Economic Daily reported.
The plant
- The ceremony was held at Purdue University with Indiana Gov. Mike Braun and U.S. Sen. Todd Young among the attendees.
- The fab will employ about 1,000 workers. The cleanroom is due in October 2028.
- Wafers made in Yongin and Icheon, South Korea, will be shipped to Indiana and finished there into HBM for USA customers.
- The report put SK hynix’s Indiana investment at more than $3.87 billion.
Why it matters for Made in USA
HBM is a key part of AI chips. Advanced packaging is a step the USA currently lacks, as with Nvidia chips fabricated in Arizona but packaged in Taiwan. The Indiana plant fills part of that gap, though the memory wafers themselves will still come from Korea, so origin will depend on where the substantial transformation happens. Related: Nvidia GB300 at TSMC Arizona.
FAQ
Where is SK hynix building its USA plant?
In West Lafayette, Indiana, near Purdue University.
When will production start?
Mass production of HBM is planned for the second half of 2029.
Will the chips be fully made in the USA?
No. Wafers will come from Korea and be packaged into HBM in Indiana.
Source & credit
Originally reported by Seoul Economic Daily (Kim Chang-young), August 28, 2026: “‘Made in USA’ HBM: SK hynix to Start Output in 2029”